Ralink Technology, Inc. (TAIEX 3534, Ralink), a leading developer of
high performance wired and wireless networking solutions, today
announced the RT3592BC8, the world’s only chipset capable of
simultaneous 300 Mbps 2x2 MIMO dual band 802.11n and Bluetooth 3.0+HS
operation. The half MiniCard solution for PCs, notebooks, netbooks and
connected mobile devices delivers an unprecedented level of performance
and intelligent coexistence between Wi-Fi and Bluetooth.
With support for concurrent operation of dual-band 802.11n Wi-Fi and
Bluetooth’s highest performance modes, the RT3592BC8 elevates wireless
mobile computing into a new level of multimedia capability. Peer-to-peer
gaming, shared and tethered connections can now be initiated via the
simplicity of Bluetooth 3.0+HS detection and setup while 2x2 MIMO
802.11n dual-band Wi-Fi boosts data rates to 300Mpbs. Able to function
in both 2.4GHz and 5GHz, the RT3592BC8 eliminates interference by
allowing Wi-Fi and Bluetooth components to coexist in the same band or
to function in separate frequency bands.
“Ralink’s new RT3592BC8 integrates all of the key wireless technologies
into a single highly-integrated solution,” said Craig Mathias, principal
at the wireless and mobile advisory firm Farpoint Group. “The
combination of 802.11n and high-speed Bluetooth provides the best of
both worlds, and we view dual-band functionality as essential to all
successful implementations.”
In addition to dual frequency band operation, the RT3592BC8 combo
solution ensures optimal radio coexistence between WLAN and Bluetooth
with a sophisticated coexistence algorithm for improved harmony between
co-located WLAN and Bluetooth radios. It dynamically adjusts WLAN and
Bluetooth transmission parameters to reduce interference, maximize
performance, and automatically adjust to the presence and operating
characteristics of nearby Wi-Fi networks. The result is a solution that
delivers up to 80 percent faster WLAN throughput compared to other
vendors’ WLAN plus Bluetooth combo solutions.
Leveraging its single-chip 2x2 dual-band 802.11n architecture, Ralink
has further integrated 14 components, saving additional cost and
delivering better performance compared to discrete Wi-Fi and Bluetooth
solutions. The optimized bill of material, simplified design, and
integrated manufacturing and testing procedures enables Ralink customers
to deliver cost-effective yet high-performance solutions in an
easy-to-integrate standard half MiniCard form factor.
“Ralink prides itself on driving new technology trends in our industry.
When the need for high-performance combinations of 802.11n and Bluetooth
became clear, Ralink responded with a number of industry-first
innovations,” said Dave Borison, Vice President of Marketing at Ralink
Technology. “Our OEM customers now have first-mover advantage with
unique capabilities ideally suited to the latest multimedia applications
-- all with the performance, flexibility, cost advantage and ease of
implementation for which Ralink is known.”
About Ralink Technology
Ralink Technology Corporation is a leading innovator and developer of
wireless and wired chipset solutions. The company’s products are
recognized for their superior throughput, extended range, low-power
consumption, and consistent reliability. Ralink’s range of patented
technologies extend Wi-Fi and wireline applications from traditional PC
networking to a variety of digital multimedia and handheld devices
including cell phones, PDAs, cameras, print servers, HDTV, gaming
devices and set-top boxes. Ralink Technology was founded in 2001 with
headquarters in Hsinchu, Taiwan and an advanced R&D center in Cupertino,
California. For more information about Ralink please visit www.ralinktech.com.
Ralink, Ralink Technology and MIMObilityTM are Ralink’s
registered trademarks; All other trademarks mentioned in this document
are the property of their respective owners.
Ralink Technology, Inc.
Joe Volat, 408-725-8070
jvolat@ralinktech.com